Sensing, Processing, Analytics & Radio Communication (SPARC) Lab

Recent Highlights

  • (Oct 2019) Our paper on EM Side Channel countermeasure titled "EM and Power SCA-resilient AES-256 in 65nm CMOS through >350x Current Domain Signature Attenuation" accepted in ISSCC 2020.
  • (Aug 2019) Collaborative work on Wearable EMG Sensor accepted in Science Advances
  • (Jul 2019) Prof. Sen invited to speak at TEDx Indianapolis in Oct 2019.
  • (Jul 2019) JSSC paper on lowest-energy Broadband HBC accepted.
  • (Jun 2019) Prof. Sen invited to write a featured IEEE Spectrum article on his work on EQS-HBC.
  • (May 2019) Best Student Paper Award at  HOST 2019, third successive year. Congratulations Debayan and co-authors.
  • (May 2019) IEEE Spectrum highlights our work on Electro-Quasistatic Human Body Communication. 
  • (Apr 2019) Best Paper Award at  CICC 2019. Congratulations Baibhab and co-authors.
  • (Jan - Mar 2019) Papers in Scientific Reports (Nature), DAC 19, CICC 19, HOST 19, and TVLSI.

Prof. Shreyas Sen explaining Physical Security of BAN

  • (Jul 03, 2018) SPARC Lab is going to lead and perform on DARPA MIDAS program.

  • (Jun 01, 2018) SPARC Lab is part of a $52m grant from Eli Lilly and Company to explore Securely Connected BioMedical DevicesUSNews Report. 
  • (Mar 08, 2018) MIT TR35 India Award: Prof. Sen has been named one of India’s top innovators under 35 by MIT Technology Review and Mint.  Mint Newspaper, Purdue News Release
    • "Purdue discovery clears way for human body to work as robust communication network for electronic devices"
    Image result for business insider Image result for ""   Image result for ecnmagRelated imageImage result for images "" Related imageImage result for "the engineer" uk logo

    Smart wearable devices allow for the exchange of information using the human body as a robust communication medium for networking electronic devices. In this photo, a researcher wears devices that allow for the exchange of information using the body to communicate instead of sending a signal through the airwaves that could be hacked.

        About the PI

        Short Bio: Dr. Sen received   his   Ph.D.    degree    in    Electrical    and    Computer    Engineering from Georgia Tech, Atlanta, USA, in 2011.  He  is  currently  an  Assistant  Professor  in  School  of  Electrical  and  Computer  Engineering,  Purdue University. He has over 5 years of industry research  experience  at  Intel  Labs,  Qualcomm  and  Rambus.  His  research  interests  include  mixed-signal circuits/systems for Internet of Things (IoT), Biomedical   and   Security.   He   has   authored/co-authored 2 book chapters, over 100 conference and journal papers and has 13 patents granted/pending.  

        In 2018, Dr. Sen was chosen by MIT Technology Review as one of the top 10 Indian  Inventors  Worldwide  under  35  (MIT  TR35  India  Award),  for  the  invention  of  using  the  Human  Body  as  a  Wire,  which  has  the  potential  to  transform healthcare, neuroscience and human-computer interaction. Dr. Sen is a  recipient  of  the  AFOSR  Young  Investigator  Award  2017,  NSF  CISE  CRII  Award  2017,  Google  Faculty  Research  Award  2017,  Intel  Labs  Divisional  Recognition Award 2014 for industry-wide impact on USB-C type, Intel PhD Fellowship 2010, IEEE Microwave Fellowship 2008, GSRC Margarida Jacome Best  Research  Award  2007,  Best  Paper  Awards  at  HOST  2017  and  2018,  ICCAD  Best-in-Track  Award  2014,  VTS  Honorable  Mention  Award  2014,  RWS Best Paper Award 2008, Intel Labs Quality Award 2012, SRC Inventor Recognition  Award  2008  and  Young  Engineering  Fellowship  2005.  He  serves/has  served  as  an  Associate  Editor  for  IEEE  Design  &  Test,  Executive  Committee  member  of  IEEE  Central  Indiana  Section,  ETS  and  Technical  Program Committee member of DAC, CICC, DATE, ISLPED, ICCAD, ITC, VLSI Design, IMSTW and VDAT. Dr. Sen is a Senior Member of IEEE.

        Full CV can be found here: CV (updated Oct 2017) 

        Research Interest

        Our group is broadly interested in research of circuits/systems that interfaces between the physical world and digital information. More specifically we focus on fundamental improvements in sensing and communication circuits/systems. This research has applications in the areas of Internet of Things (IoT), Biomedical and Security, among others. 

        Channel Models, Circuits/Systems and Applications for:
        • IoT Sensor Nodes

        More details about our groups research can be found in the Research page.

        Current Affiliation

        Assistant Professor, 
        Electrical and Computer Engineering (ECE)
        Purdue University

        Office: MSEE 226 
        Email:  shreyas [at]
                          shreyas.sen [at]

        Purdue University 
        School of Electrical and Computer Engineering 
        Electrical Engineering Building 
        465 Northwestern Ave. 
        West Lafayette, Indiana 47907-2035

        Dee Dee Dexter 
        Office: MSEE 268 
        Phone: (765) 494 3558 
        E-mail: ddexter [at]

        Sparc Lab Research Sponsors

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        SPARC Lab is going to lead and perform on a DARPA program.

        SPARC Lab is part of a $52m grant from Eli Lilly and Company to explore Securely Connected BioMedical Devices. 

        Dr. Sen invited to be part of discussions defining AFRL S&T vision for 2030. 

        Best Poster Award (3rd) at HOST

        Dr. Sen is now a Senior Member of IEEE

        Dr. Sen to serve on the TPC of Design Automation Conference (DAC) and Custom Integrated Circuits Conference (CICC) 

        HOST Best Student Paper Award 2017

        Dr. Sen to serve on the TPC of IEEE ICCAD & IMSTW

        Dr. Sen speaks at Invited Tutorial in IEEE Sensors 2016 on Context-Aware IoT Sensor Nodes

        Dr. Sen delivers Invited Talk in US-Korea Forum on NanoTechnology on Neuromorphic Computing in CMOS

        Serving on IEEE Technical Committee on Cyber-Physical Systems (CPS)

        Dr. Sen speaks at Invited Talk in DAC 2016 on Context-Aware Comms for IoT 

        Serving on the TPC of DATE 2017

        Serving as Publicity Chair for IEEE ETS' 17 

        Paper presented in ISSCC 2016 on Proximity Comm. (23.2) demonstrating world's fastest and most energy-efficient board-to-board capacitive communication link. 

        Serving on Industry support group for IMSTW 2015

        Divisional Recognition Award 2014 - ADR, Intel Labs for impact on USB-C type

        Serving as Starnet Industry Associate 

        Serving as a TPC member of VLSI Design 2015

        Serving as a TPC member of ITC 2014 

        Intel Labs Quality Award 2012

        2nd Best Thesis Award